Jabil's roots lie in the assembly and testing of printed circuit boards. Today, from worldwide locations, we support high and low-mix PCB and backplane assembly for volumes that range from just a few units for prototypes, to modest quantities for pre-production, to hundreds of thousands in volume production.

Our assembly services are complemented by front-end product development capabilities including strong CAD layout and design experience. And of course, quality is always first - we employ DFX fundamentals as well as quality and data-tracking methodologies.

PCB Capabilities

• 0201s
• CCGA
• COB
• CSPs
• Double sided, mirrored BGA assembly
• Double sided, single reflow processing
• Fine pitch high pin count press fit connectors
• Flip chip
• Lead-free assembly
• MCMs
• MEMs
• Mictor connectors
• uBGA
• Bare die attach
• Continuous flow SMT lines

Backplane Capabilities

• Size up to 24" x 36” x .5” x 48+ layers
• RoHS and Tin Lead
• Aqueous and No Clean
• SMT, Wave, and Automatic 12 Ton closed-loop press fit
• Fixtureless Test and AOI - 33,792 nodes
• High Resolution Transmissive XRay Inspection
• Contact John_Head@Jabil.com